Книжки Наука і Техніка Радіоелектроніка, радіотехніка, зв'язок Електроніка

Книга 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility

Name: 3D IC and RF SiPs: Advanced Stacking and Planar Solutions for 5G Mobility
SKU: 20368021
Price: 7514 UAH
Availability: OutOfStock

Ліх-Тинг Хванг, Ций-Шенг Джейсон Хорнг

Формат

Мова книги

Видавництво

Рік видання

Категорія

Основи інформатики Електроніка Архітектура комп’ютера та логічне програмування

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
Provides chapter-wise review questions and powerpoint slides as teaching tools

Код товару

20368021

Характеристики

Автор

Ліх-Тинг Хванг, Ций-Шенг Джейсон Хорнг

Тип обкладинки

Тверда

Мова

Англійська

Опис книги

An interdisciplinary guide to enabling technologies for 3D ICs and 5G mobility, covering packaging, design to product life and reliability assessments

Features an interdisciplinary approach to the enabling technologies and hardware for 3D ICs and 5G mobility
Presents statistical treatments and examples with tools that are easily accessible, such as Microsoft’s Excel and Minitab
Fundamental design topics such as electromagnetic design for logic and RF/passives centric circuits are explained in detail
Provides chapter-wise review questions and powerpoint slides as teaching tools

Відгуки

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